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ROC800-Series Instruction Manual

Revised Jul-14

Input/Output Modules

4-1

Chapter 4 – Input/Output Modules

This chapter describes the Input/Output (I/O) modules used with the

ROC800 and expansion backplanes and contains information on

installing, wiring, and removing those modules.

In This Chapter

4.1 I/O Module Overview.............................................................................. 4-1 4.2 Installation .............................................................................................. 4-4 4.2.1 Removing and Installing Wire Channel Covers .......................... 4-4 4.2.2 Removing and Installing Module Slot Covers ............................. 4-5 4.2.3 Installing an I/O Module .............................................................. 4-5 4.2.4 Removing an I/O Module ............................................................ 4-7 4.2.5 Wiring I/O Modules ..................................................................... 4-7 4.3 Analog Input (AI) Modules...................................................................... 4-7 4.4 Analog Output (AO) Modules ................................................................. 4-9 4.5 Discrete Input (DI) Modules ................................................................. 4-10 4.6 Pulse Input (PI) Modules...................................................................... 4-12 4.7 Discrete Output (DO) Modules............................................................. 4-13 4.8 Discrete Output Relay (DOR) Modules ................................................ 4-15 4.9 Resistance Temperature Detector (RTD) Input Modules .................... 4-16 4.10 Advanced Pulse Module (APM) ........................................................... 4-18 4.11 Multi-Variable Sensor Input/Output (MVS I/O)..................................... 4-21 4.12 Alternating Current Input/Output (AC I/O) Module ............................... 4-25 4.13 Thermocouple (TC) Input Module ........................................................ 4-27 4.14 Highway Addressable Remote Transducer (HART ® ) Module ............. 4-31 4.15 IEC 62591 ............................................................................................ 4-33 4.16 APP 485 Module .................................................................................. 4-35 4.17 Additional Technical Information .......................................................... 4-36

4.1 I/O Module Overview

The I/O modules typically consist of a terminal block for field wiring

and connectors to the backplane. Each I/O module uses a removable

terminal block to electrically connect to field wiring. Refer to

Figures

4-1

and

4-2

.

Note

:

Figure 4-2

represents a ROC827 with one EXP.